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As the European data centre market continues to evolve under the pressure of AI-driven workloads, increasing rack densities, and sustainability targets, infrastructure design is entering a new phase — where efficiency, scalability, and thermal management are critical.
Against this backdrop, INVT will present its latest AI-ready data centre infrastructure solutions at Data Centre World Frankfurt 2026, taking place on May 6–7 at Messe Frankfurt (Booth 8K131).
At the centre of the showcase is INVT’s modular UPS portfolio. A newly launched 150 kW high-density power module enables scalable deployment for megawatt-level backup systems, supporting flexible capacity expansion while maintaining high efficiency and reliability. The modular architecture allows operators to optimize footprint and adapt to changing load demands.
INVT will also present rack-mounted UPS solutions in the 1–3 kVA range, featuring a power factor of 1.0 and compatibility with lithium-ion and lead-acid batteries.
As liquid cooling becomes increasingly relevant in Europe’s high-density data centre landscape, INVT will showcase its SC Series Coolant Distribution Unit (CDU).
Designed for liquid-to-liquid cooling architectures, the CDU supports high-performance computing environments and high-density racks, enabling more efficient heat dissipation compared to traditional air cooling approaches. This aligns with the industry’s transition toward hybrid and liquid cooling strategies to support AI infrastructure.
Beyond individual components, INVT will also highlight its modular data centre solutions, designed for rapid deployment and flexible expansion. These solutions are suitable for a broad range of sectors, including telecommunications, financial services, healthcare and education. By integrating power, cooling, and IT infrastructure into standardized modules, INVT supports faster time-to-market while ensuring consistent performance and reliability.
More information about data centre solutions from INVT