Legrand's Infinium acclAIM™ Platform Expands Interoperability with SENKO SN®-Footprint Connectivity

Legrand’s Infinium acclAIM™ Platform Expands Interoperability with SENKO SN®-Footprint Connectivity

Collaboration enhances high-density fiber infrastructure with improved flexibility and sustainability.

Legrand has expanded interoperability between its Infinium acclAIM™ fiber solution and SENKO’s SN® -footprint connectivity. Legrand’s Infinium acclAIM platform redefines backbone connectivity by replacing traditional cassette-based designs with direct mating breakout connections. This architecture supports ultra-high-density fiber deployments, up to 288 fibers per rack unit, effectively doubling the density of conventional LC-based panels while maintaining exceptional optical performance through precision ceramic ferrule technology.

To support environments where SN-footprint connectivity is preferred at the equipment interface, Legrand and SENKO have collaborated on an adapter solution that enables seamless interoperability between the acclAIM backbone connector and the SN footprint at the front of the patch panel. This solution gives customers greater deployment flexibility without compromising the integrity or performance of the acclAIM system.

The SN is ceramic-based fiber optic connector so compact and flexible that it can be utilized either as a Base-8 trunk solution, a Base-2 patching interface or as a Base-8 connection to next generation 200G, 400G, and 800G transceivers.

Beyond density and performance, the acclAIM platform also contributes to more sustainable data center design. By eliminating cassette layers and reducing the number of components required to build fiber links, acclAIM minimizes material usage, simplifies installation, and supports longer infrastructure lifecycles. Fewer components mean reduced hardware consumption, lower embodied carbon, and improved long-term scalability.

Reimagine the Cassette: acclAIM offers one-to-one cassette functionality, design, and administration – without the cassette

Key Quote

“SENKO is delighted to collaborate with Legrand, a company leading the way in ceramic multi-fiber backbone connectivity with its acclAIM platform,” said Phil Ward, Director of Strategic Marketing, SENKO. “By enabling interoperability with the SN footprint, we’re giving customers greater architectural flexibility while supporting high-density, low-loss fiber infrastructures. Just as important, by simplifying connectivity, we reduce unnecessary hardware layers and contribute to a more sustainable and future-ready data center environment.”

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More information about Infinium acclAIM™ fiber solutions from Legrand

More information about data center solutions from Legrand

More information about SENKO’s SN® -footprint connectivity

SN® mini connector data sheet