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Enabling AI infrastructure scaling: Marvell advanced optical and silicon design leverages leading-edge process nodes to deliver the improvements in performance, bandwidth density and power critical to scaling AI infrastructure efficiently.
Marvell Technology, Inc. (NASDAQ: MRVL) demonstrated its industry-first 2nm optical interconnect that advances the next generation of AI data center connectivity at the European Conference on Optical Communication (ECOC).
As AI data center architectures scale from 1.6T to 3.2T and beyond, operators require faster, lower-power and more secure optical interconnects to serve AI scale-up, scale-out and scale-across domains. Increasing bandwidth density while reducing power per bit has become critical to scaling AI infrastructure efficiently.
Building upon a multi-generational history of industry firsts — including the first 5nm 200G/lane 1.6T Marvell® Nova DSPs in 2023, the 3nm 1.6T Ara platform in 2024 and the 2nm 800G Libra DSPs announced earlier this year — Marvell is extending its portfolio of industry-leading 2nm connectivity solutions, including optical PAM4, coherent-lite PAM4/IMDD and ZR/ZR+ coherent solutions in the 2nm node. These technologies are optimized to enable ultra-high-speed interconnects that deliver faster communication between XPUs, CPUs, accelerators, and memory resources and improve energy efficiency to help data center operators manage the ever-increasing power demands of large AI deployments.
“AI data center operators need optical interconnect technologies that deliver higher bandwidth, lower power and greater security across every part of the network,” said Xi Wang, senior vice president and general manager, Connectivity Business Unit at Marvell. “These ECOC demonstrations highlight how Marvell continually pushes the envelope of what is possible in optical technology to help hyperscaler and cloud data center customers achieve new levels of performance, efficiency and scalability to drive new waves of innovation.”
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