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Panduit has launched its Direct-to-Chip (DTC) Cooling System, an advancement in liquid cooling technology engineered for high-density AI and High Performance Computing environments. The Panduit DTC accelerates deployment, reduces installation risk, and delivers scalable thermal management within a standard cabinet footprint.
As AI workloads continue to push the boundaries of compute performance, data centers face mounting pressure to manage heat efficiently. DTC Cooling System addresses this challenge head-on, offering a future-ready solution that aligns with sustainability goals and operational efficiency.
“Our DTC Cooling System reflects Panduit’s commitment to solving real-world infrastructure challenges with smart, scalable solutions,” said David Weksel, Director of Strategic Growth of Panduit Ventures. “This launch marks a major step forward in enabling AI-ready environments that are efficient, reliable, and future-proof.”
Engineered for High-Density Compute
The DTC Cooling System includes FlexFusion™ cabinets and rack manifolds that work together to deliver uniform, leak-free liquid cooling directly to the chip. Key features include:
This design enables data center operators to deploy high-density AI servers without compromising space, speed, or reliability.
The DTC Cooling System complements Panduit’s existing Rear Door Heat Exchanger (RDHx) offering, creating a comprehensive liquid cooling strategy for modern data centers. Together, these solutions support scalable infrastructure across AI, HPC, and edge computing environments.
The Direct-to-Chip Cooling System is available now in the United States.
More information about the Direct-to-Chip (DTC) Cooling System from Panduit