Samtec Inks Second-Source License Agreement with Molex to Expand Reach of Si-Fly HD High-Speed Interconnects for Data Center Applications

Samtec, Inc and Molex have announced a license agreement naming Molex as a second source for the Samtec Si-Fly® HD product family. This collaboration provides customers with extended product availability and supply flexibility to a portfolio of robust, scalable connectivity solutions for a wide range of high-performance applications demanding high signal integrity and density.

The Si-Fly HD product family delivers industry-leading signal integrity for high-speed applications and supports data rates critical for modern networking, communications, and computing systems. As part of the agreement, Molex will manufacture and distribute these interconnects to customers worldwide, ensuring uninterrupted access to advanced connectivity solutions, while benefiting from the combined engineering and support expertise of both teams.

“Collaborating with Molex as a second source for Si-Fly HD demonstrates our commitment to providing customers with reliable worldwide supply and exceptional technical support,” said Brian Vicich, CTO of Samtec. “Molex’s manufacturing capabilities, deep engineering expertise, and global reach make them an ideal resource to extend the availability of this high-performance interconnect family.”

The agreement reflects a strategic alignment between industry leaders focused on delivering high-speed, high-density interconnect solutions for a wide range of data center, high-performance computing, artificial intelligence and machine learning applications. Customers can expect the same quality, form, fit, and function from Molex’s Si-Fly HD products, ensuring seamless integration into existing Samtec-based systems.

“Working together strengthens our commitment to providing customers with greater optionality and supply flexibility, while expanding our product portfolio,” said Jairo Guerrero, vice president & general manager, Copper Solutions, Molex. “By combining our technical expertise with Samtec’s innovative technology, we’re ensuring customers have seamless access to high-performance interconnect solutions that support their evolving design and supply chain needs.” 

Features

• High-density 224 Gbps PAM4 co-packaged and near-chip (ASIC adjacent) cable systems
• CPX: electrically pluggable co-packaged copper & co-packaged optic high-density, high-performance interconnects on a 95 mm x 95 mm or smaller substrate (SFCM, SFCC, Optics)
• Co-packaged CPX offers the lowest loss signal transmission from the package to the front panel or backplane while providing the highest density (use copper for short distances/scale up, optics for extended reach/scale out)
• PCIe® 7.0 capable
• Eye Speed® Hyper Low Skew Twinax cable technology supports 224G signaling with an industry leading 1.75 ps/m max intra-pair skew
• Placement of Flyover® cable solutions on, or near, the chip package improves transmission line density and extends signal reach in high-performance applications
• High-density mezzanine arrays feature 64 differential pairs per square inch
• Routes an extremely high number of transmission lines from one PCB to the next
• Surface mount reflow technology to the PCB

More information about the Samtec Si-Fly® HD product family

Samtec high speed cable guide