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SEMI, the industry association serving the global semiconductor and electronics design and manufacturing supply chain, has announced the program for its 37th annual Advanced Semiconductor Manufacturing Conference (ASMC), taking place from May 11-14 in Albany, New York. The premier, four-day technical conference will feature more than 100 speakers, convening semiconductor industry leaders to solve core manufacturing challenges in areas including advanced materials, big data management, process control, wafer-level processing, and yield optimization. Registration is open.
Challenges and Opportunities for Semiconductor Manufacturing Equipment in the AI Age
The Use of AI in High Volume Manufacturing: From Concept to Application
Panel Discussion on Quantum Computing and Manufacturing Challenges
Industry Market Forecast
Tutorial Presentation – From Hype to Implementation: Building the Core Pillars for AI in Semiconductors
Despite intense executive interest and extensive pilot activity, more than 70% of semiconductor AI initiatives stall before achieving enterprise-scale adoption. On Tuesday, May 12, Jonathan Holt, Senior Director of Product Management at PDF Solutions, will offer an actionable blueprint for high-value AI implementation to help bridge this gap.
SEMI University Workshops: Returning for the second time at ASMC, SEMI U will offer three in-person, instructor-led trainings: Understanding Semiconductor Technology & Business, Advanced IC Packaging & Assembly, and Overview of Semiconductor Manufacturing. ASMC attendees receive a $100 discount on SEMI U registration.
Women in Semiconductors (WiS): Open to all industry professionals, the WiS program will focus on strategies for building influence, leading with confidence, and expanding career opportunities. ASMC registrants receive complimentary registration.
SEMI Standards Spring Meetings: The SEMI Standards process has been used to create more than 1,000 industry-approved standards and guidelines, based on the work of more than 6,000 volunteers. All SEMI Standards members are welcome to participate in the 2026 Spring Meetings. Register for membership at no cost.
SCIS General Meeting: The Semiconductor Components, Instruments, and Subsystems (SCIS) Technology Community General Meeting will take place on Thursday, May 14. All SEMI SCIS members are welcome to attend.
Glass4Chips Summit: Hosted at NY Creates on May 14 and at the Hilton Albany on May 15, this two-day summit will address barriers to glass substrate adoption and outline strategies to strengthen the U.S. glass supply chain. This will be held in partnership with SEMI, NY Creates, and FuzeHub. Registration is open.
ASMC 2026 is co‑chaired by Olaf Storbeck, Lead Principal Thermal Processes at Infineon Technologies, and Thirumalesh Bannuru, former Area Manager at Wolfspeed.
Full conference details