Subscribe to Our Digest
Stäubli revolutionizes data centers with advanced electrical and liquid cooling connectivity for OCP Open Rack v3, enabling efficient, reliable AI system scaling and superior thermal management.
The rapid adoption of AI is accelerating power consumption and heat generation within data centers. Higher rack densities require a new approach where power distribution and thermal management are no longer considered separately but as interconnected parts of the same infrastructure.
To address these challenges, Stäubli works closely with key players across the data center ecosystem and contributes to industry initiatives such as the Open Compute Project (OCP). This collaboration helps ensure that emerging solutions align with real operational requirements for high-density computing environments.
Reliable power delivery and effective heat removal are fundamental to ensuring continuous operation. Electrical connectors designed for high-current applications, including solutions compatible with OCP Open Rack v3 (ORv3) architectures, support safe and efficient power distribution across the data center—from switchgear, UPS systems, and power distribution units to rack-level applications.
At the same time, liquid cooling technologies enabled by non-spill quick couplings, such as the Stäubli UQD range developed in line with OCP specifications, help manage increasing thermal loads while simplifying maintenance operations. Stäubli’s liquid cooling portfolio covers the entire cooling loop, from high-flow connectors supporting facility infrastructure, CDUs, and manifold connections. It also includes compact quick couplings designed for servers, blades, and next-generation optical modules, where space constraints and thermal performance are critical.
By combining expertise in electrical and fluid connectivity, Stäubli helps data center operators improve uptime, scalability, and energy efficiency, while supporting the transition toward increasingly dense and modular AI infrastructures.
While many suppliers specialize in either power distribution or cooling technologies, Stäubli combines decades of experience in both electrical and fluid connection solutions. This unique expertise enables a more integrated approach to infrastructure design, supporting the evolution of AI-ready data centers.
“As AI infrastructures continue to evolve, the industry’s challenge is no longer simply delivering more power or more cooling. The priority is to ensure both systems work together efficiently, reliably, and at scale. At Stäubli, our expertise in electrical and fluid connectivity allows us to support this transformation and help shape the future of data center infrastructure,” said Jean Christophe DUISIT, High potential for Data centers, Stäubli.
Meet Stäubli at upcoming industry events:
More information about Stäubli’s liquid cooling portfolio