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Expanded ten-model portfolio supports cooling chill door capacities from 10kW up to 120kW for systems level to rack-scale AI factories.
Super Micro Computer, Inc. (NASDAQ: SMCI) has announced the expansion of its Rear Door Heat Exchanger (RDHx) portfolio, further strengthening its end-to-end liquid cooling solutions for high-density AI and HPC infrastructure. As a key component of DCBBS, the expanded RDHx portfolio offers flexible cooling capacities, providing data center operators with an easy-to-deploy path to liquid cooling for both new and legacy data centers.
Customers can design and deploy validated rack-scale cooling solutions tailored to their facility requirements, infrastructure constraints, and workload demands, enabling higher compute density, improved cooling efficiency, and lower total-cost-of-ownership (TCO). The expanded portfolio of ten RDHx models can be deployed as a primary liquid cooling solution or integrated with Supermicro’s Direct-to-Chip (D2C) liquid cooling technologies as part of a complete DCBBS infrastructure solution.
Supporting cooling capacities from 10kW up to 120kW per rack, RDHx enables organizations to increase compute density and cooling efficiency for AI and HPC workloads without requiring major facility modifications. Compatible with standard EIA, ORv3, and MGX racks, the solutions integrate seamlessly into both new data center deployments and existing facilities. As part of Supermicro’s validated DCBBS portfolio, RDHx can be delivered with accelerated systems, rack-scale integration, facility power and cooling, intelligent management software, and deployment services, enabling customers to simplify procurement, reduce integration risk, and reduce Time-to-Online (TTO).
Supermicro DCBBS delivers complete, modular AI infrastructure built from validated components and subsystems, enabling flexible deployment from individual servers and networking to full rack-scale and data center-level solutions, including software and services. Supermicro continues to lead the industry with its comprehensive portfolio of AI infrastructure solutions, enabling organizations worldwide to deploy scalable, efficient, and environmentally responsible AI data centers.
“We continue to expand our DCBBS offerings to provide our customers with unmatched customization and optimization options,” said Charles Liang, president and CEO of Supermicro. “Our expanded RDHx portfolio helps customers realize the benefits of liquid cooling, with a range from 10kW up to 120kW of cooling at the door level, with a max of 240kW of cooling capacity at the rack-level, enabling more efficient data center operations.”
More information about Supermicro’s RDHx portfolio
More information about the full range of Supermicro liquid cooling solutions from Supermicro
More information about DCBBS modular infrastructure options