Molex – Data Centre Digest

Molex Unveils VersaBeam Mini to Advance Ultra-Dense, Eye-Safe Optical Interconnects for Next-Generation AI Data Centers

Molex Announces VersaBeam Mini to Advance Ultra-Dense, Eye-Safe Optical Interconnects for Next-Generation AI Data Centers

Delivers 3x density improvement in an ultra-compact form factor, supporting up to 3,456 fibers in a 1RU panel for AI scale-up and scale-out architectures. Read more

Molex Invests in CAEPlus to Advance Thermal Management with Active Liquid Cooling Solutions for AI Data Centers

Collaboration aims to accelerate development and validation of proprietary active cooling platform to enhance heat transfer in liquid-cooled systems.

Molex, a global electronics leader and connectivity innovator, today announced a strategic investment in CAEPlus, Inc., an Read more

Molex Unveils Multi-Channel Liquid Cooled Busbar Capability to Power Next-Generation AI Data Centers

Molex Multi-Channel Liquid Cooled Busbars extend liquid cooling into the power backbone to support higher-current AI racks with more uniform heat extraction.

Unique seven-channel architecture enables uniform heat extraction for HPR busbars, yielding up to 20% greater cooling efficiency compared to single-channel designs. Read more

Molex Completes Acquisition of Smiths Interconnects, Expands Data Center Solutions

Molex Completes Acquisition of Smiths Interconnect, Expanding Portfolio of High-Reliability Connectivity Solutions

Molex has completed the acquisition of Smiths Interconnect, a subsidiary of United Kingdom-based Smiths Group plc, marking a major milestone in Molex’s vision to enable technology that is transforming the future and improving people’s lives. Smiths Interconnect brings Read more

Molex Claims to Reduce AI Cluster Deployment Time by 85% with New Optical Product Offering

High-Radix Optical Circuit Switch (OCS) Platform from Molex

Enhanced CPO toolkit with versatile format interconnect (VFI) optical backplane system and external laser source small form factor pluggable (ELSFP) increase density by 50% and cut system power consumption. Read more

Molex Releases Impress Co-Packaged Copper Solutions, Scaling Near-ASIC Connectivity Innovations

Molex Impress Co-Packaged Copper (CPC) Solution

Compression-based, on-substrate connector and cable assembly optimize signal integrity and efficient power distribution at speeds of 224Gbps PAM-4 and beyond

Molex has launched its Impress Co-Packaged Copper Solutions to meet the needs of next-generation data centers and Read more

Samtec Inks Second-Source License Agreement with Molex to Expand Reach of Si-Fly HD High-Speed Interconnects for Data Center Applications

Samtec, Inc and Molex have announced a license agreement naming Molex as a second source for the Samtec Si-Fly® HD product family. This collaboration provides customers with extended product availability and supply flexibility to a portfolio Read more

Molex: Versatile VaporConnect Optical Feedthrough Modules Enabling Thermal Management Innovations to Address AI-Driven Data Center Growth

A cassette-based solution for two-phase immersion cooling that reduces time and cost in hyperscale data center installations, Molex’s new VaporConnect Optical Feedthrough Modules streamline connectivity and thermal management for AI-driven data center growth.

Molex has recently introduced a thermal Read more