Teradyne Expands UltraFLEXplus Platform with Three Instruments Designed for Data Center Device Testing

Teradyne announced the launch of three new instruments for its UltraFLEXplus platform, designed to meet the increasingly complex demands of AI and data center semiconductor testing.
New instruments for the UltraFLEXplus platform deliver speed, power, and precision to meet complex demands of AI and data center semiconductor testing. Read more
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Teradyne and MultiLane Join Forces to Serve AI Data Centers

Teradyne and MultiLane Announce Formation of Joint Venture, MultiLane Test Products

Joint venture, MultiLane Test Products (MLTP), is expected to position both companies to deliver greater value to customers by accelerating innovation and expanding access to comprehensive test solutions for the rapidly evolving AI and data center markets.

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