VEIR Demonstrates 3-Megawatt Superconducting Power Delivery for AI Data Centers, Eliminating Critical Growth Bottleneck

First generation technology delivers 10x more power within compact footprint, providing scalable, ready-for-market solution for new data center designs, more power in less space

VEIR has announced that its first-generation Superconducting Technology for AI Racks (aka “STAR”) Demonstration has successfully delivered 3 megawatts of power via a single low voltage cable within a simulated and scalable data center environment. Following a $75M Series B funding round this past January, including investors like Munich Re Ventures, Microsoft’s Climate Innovation Fund, and National Grid, this demonstration highlights the safe and effective use of VEIR’s first-of-its-kind low-voltage superconductor cables to deliver power in and around AI factories and data centers, solving a critical bottleneck for the expanding data center market.

“The power bottleneck is the single biggest constraint for AI and data center growth,” said Tim Heidel, CEO of VEIR. “This demonstration marks a major milestone for VEIR and the industry, proving that superconducting power technology can deliver the high-power levels needed in a data center environment, while dramatically reducing the space and weight demanded by traditional systems. Our technology is ready to deploy and provides an immediate solution needed to power the next generation of computing.”

According to the International Energy Agency, global data center electricity usage is projected to more than double over the next five years, reaching 945 TWh per year by 2030, with server racks alone requiring >500 kW per rack to support AI workloads. Conventional electrical infrastructure cannot meet these complex power and infrastructure needs, pushing traditional busbar and cable systems to their limits.

Leveraging its patented superconductivity technology, VEIR has pioneered a compact, high-power-density solution that operates with zero electrical resistance. Integrating a novel cooling system, the solution delivers up to 10 times greater power and covers more than 5 times the distance of conventional options, enabling smaller, more flexible data center footprints and faster deployment.

“This is not just a technological step forward; it’s a monumental shift in how we power the digital economy,” said Peter Gross, a globally recognized data center expert. “Having spent decades in the mission-critical and data center space, I can attest that conventional solutions are hitting a wall. The successful demonstration of VEIR’s technology shows that a new path for high power density, high-reliability infrastructure is not only possible but ready to be integrated into today’s data center designs.”

Key Outcomes of STAR Demonstration:

Executed within a simulated data center environment near VEIR headquarters in Woburn, Massachusetts, STAR demonstrates the commercial readiness of VEIR’s technology for data center applications:

• Technological Milestone: The demonstration proved that VEIR’s first-of-its-kind superconducting technology can scale to deliver hundreds of megawatts of power in and around a physical building space, a critical step for data center campuses.
• Proven Integration: The demonstration of a low voltage superconducting system designed for up to 800V operation and capable of carrying more than 3 MW per cable confirms its integration capabilities, safety, resilience, and reliability across a range of data center environments. 
• More Power, Less Space: VEIR’s technology moves up to 10 times more power with less and smaller cables, enabling a more than 20 times smaller routing footprint for low-voltage power and 5 times the distance covered compared to traditional cables, supporting higher compute density and reduced latency.
• Faster Time-to-Market: The STAR Demonstration’s end-to-end design-to-build process, leveraging internal expertise and close collaboration with partners, demonstrates VEIR’s ability to deliver a commercial solution quickly.

“Our integrated team designed STAR from the ground up to solve the high power density and delivery problems emerging in data centers. Using superconducting technology, we are able to move massive amounts of power to maximize performance – safely, reliably, and at scale,” said Erhan Karaca, VEIR CTO. “This demonstration establishes a clear path to a scalable solution that can be quickly deployed, giving data center architects the flexibility they need for next-gen designs.”

VEIR’s successful STAR Demonstration marks a decisive moment for the data center industry. The technology proves a high-power-density, low-latency future is achievable, surpassing the limitations of conventional power delivery. VEIR is expected to announce the technology’s first adopters in the coming months as it moves toward full commercialization in 2026.

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