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Vertiv (NYSE: VRT) has announced new rack, power, and cooling technologies designed to align with Open Compute Project (OCP) design guidelines and support high-density, energy-efficient data center environments.
Vertiv’s technologies demonstrate a broad range of OCP-aligned designs and concepts across multiple product categories. The Vertiv™ SmartIT OCP rack solution is a configurable, high-capacity rack system developed to simplify integration for system builders and support a variety of server and equipment types. The concept supports loads up to 142 kW and offers prefabricated configurations that combine validated power and cooling options for faster deployment and improved reliability.
Vertiv™ PowerIT rack power distribution units (PDUs), high-capacity systems recently released in North America and EMEA, provide up to 57.6 kW of power, with monitored and switched models delivering advanced power management, load balancing, and cybersecurity features.
Vertiv™ PowerBar Track is a scalable, overhead power distribution system engineered for high-density AI and HPC environments. Its modular, open-track busbar architecture optimizes space, simplifies installation, and provides continuous power delivery. The system supports business continuity through reliable, upgradable components designed for future expansion.
Vertiv™ CoolChip Fluid Network manifolds from Vertiv’s liquid cooling portfolio will also be on display in the booth rack, illustrating flexible and efficient approaches to managing thermal loads in high-density environments. These manifolds integrate with the Vertiv™ CoolChip CDU family and reflect ongoing development of modular, adaptive cooling technologies for AI and next-generation compute architectures.
More information about Vertiv’s OCP-compliant solutions and full portfolio of infrastructure offerings