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New TOLT (TO-Leaded, Top-Side Cooled) package, built on Wolfspeed’s Gen 4 MOSFET technology, enables higher power density and thermal performance for next-generation AI data centers.
Wolfspeed, Inc. (NYSE: WOLF), a global leader in silicon carbide technology, has introduced its new TOLT package portfolio, which enables maximum power density in a power supply for data center rack applications. The TOLT package is engineered to release heat from the top side of the package, making cooling far more efficient. This enables companies to build smaller, more reliable power systems that support the rising demands of AI data centers.
“AI is pushing datacenter OEMs to be incredibly strategic about the size and total efficiency of their power systems,” said Guy Moxey, vice president of Wolfspeed’s Industrial & Energy business. “Our TOLT product family offers a straightforward path to delivering higher-density, thermally optimized power systems capable of sustaining the demands of AI data centers, and Wolfspeed’s Gen 4 technology helps these systems run cooler, more efficiently, and more reliably.”
Silicon carbide technology is one of the fastest-growing components of both the power device market and the greater semiconductor industry. A superior alternative to silicon, silicon carbide is ideal for high power applications – such as AI data centers, e-mobility, renewable energy systems, and battery energy storage systems – that unlock improved performance and lower system costs.
As global markets prioritize supply chain resiliency, it is crucial that the U.S. continues to make strategic investments to cement its technological dominance, while continuing to spur American innovation in critical technologies. Wolfspeed’s U.S.-based silicon carbide substrate production supports rapidly scaling AI projects by providing a stable, domestic supply for mission-critical power systems.
More information about Wolfspeed’s 650 V TOLT products
More information about data center solutions from Wolfspeed